Photoresist Overview
Photoresist, also known as photoresist, refers to a thin film material whose solubility changes when exposed to UV light, electron beams, ion beams, X-rays, or other radiation.
It is composed of a resin, a photoinitiator, a solvent, a monomer, and other additives (see Table 1). Photoresist resin and photoinitiator are the most important components affecting photoresist performance. It is used as an anti-corrosion coating during the photolithography process.
When processing semiconductor surfaces, using an appropriately selective photoresist can create the desired image on the surface.
Table 1.
| Photoresist Ingredients | Performance |
|
Solvent |
It makes photoresist fluid and volatile, and have almost no effect on the chemical properties of photoresist. |
|
Photoinitiator |
It is also known as photosensitizer or photocuring agent, is the photosensitive component in photoresist material. It is a type of compound that can decompose into free radicals or cations and initiate chemical cross-linking reactions in monomers after absorbing ultraviolet or visible light energy of a certain wavelength. |
|
Resin |
It is inert polymers, and acts as binders to hold the different materials in a photoresist together, giving the photoresist its mechanical and chemical properties. |
|
Monomer |
It is also known as active diluents, are small molecules containing polymerizable functional groups and are low molecular weight compounds that can participate in polymerization reactions to form high molecular weight resins. |
|
Additive |
It is used to control the specific chemical properties of photoresists. |
Photoresists are classified into two main categories based on the image they form: positive and negative. During the photoresist process, after exposure and development, the exposed portions of the coating are dissolved, leaving the unexposed portions. This coating is considered a positive photoresist. If the exposed portions remain while the unexposed portions are dissolved, the coating is considered a negative photoresist. Depending on the exposure light source and radiation source, photoresists are further categorized as UV (including positive and negative UV photoresists), deep UV (DUV) photoresists, X-ray photoresists, electron beam photoresists, and ion beam photoresists.
Photoresist is primarily used in the processing of fine-grained patterns in display panels, integrated circuits, and discrete semiconductor devices. The production technology behind photoresist is complex, with a wide variety of product types and specifications. The electronics industry's integrated circuit manufacturing imposes stringent requirements on the photoresist used.
Ever Ray, a manufacturer with 20 years of experience specializing in the production and development of photocurable resins, boasts an annual production capacity of 20,000 tons, a comprehensive product line, and the ability to customize products. In photoresist, Ever Ray has 17501 resin as the main component.
